Gold plating is used extensively throughout the electronics, semiconductor and space industries. The nature of this noble metal readily lends itself to high reliability applications for land, sea and space based communications components. Type II deposits contain hardening connectors. While Type III deposits are pure gold (99.9%) and are used in wire bonding and die bonding applications for hi-rel circuitry. Both types are extremely solderable and conductive.
Specification Numbers for Gold Plating
- Mil-G-45204 (Type II, Grade C & Type III, Grade A)
- ASTM-B-488-01(Type II, Code C & Type III, Code A